Going Vertical - The 4D Chips Blog. The era of increasing functionality by expanding die area is over. According to a story in the Wall Street Journal, TI. Plans to acquire National Semiconductor.

No 4-31-2-204, Yoyogi, Shibuya-Ku,. The Tokyo operations office of LEA focused mainly on marketing and the research of new cooling technology. Utilizing innovative aluminum vapor chamber heat sink technology provides a strong competitive advantage to our customers. This is the next generation of thermal technology, this can be scales to meet your specific needs. We are attending Automotive World 2015.

Materials, Compounds, Adhesives, Substrates. Developing a Thetajc Standard Under Steady-State Testing Conditions. Use of the Monte Carlo Method in Packaging Thermal Calculations. Beat the Heat in 3D Chip Stacks with Embedded Cooling. Parida, Mark Schultz and Timothy Chainer J.

4 Critical Things to Consider While Selecting a Fuse for Control Circuit Protection. An electric fuse is an important electrical component that protects against overcurrent events by melting its elements and opening the circuit. Fuses must be applied at or below their specified voltage rating, which differs between ac and dc current. Rugged Box PCs Redefine Embedded Systems through Modular Design.

Model reduction is an efficient means to enable system-level simulation. The goal of this site is to promote the use of model reduction in industry to obtain compact models directly from finite element models. In a way, model order reduction offers a direct link between ANSYS and system level simulation software like ANSYS Simplorer. The site content is biased toward my personal work although references to key books, theses, papers and links to other groups are also included.